Group offer

TECNOLOGIE DI ASSIEMAGGIO TECNOLOGIE DI ASSIEMAGGIO TECNOLOGIE DI ASSIEMAGGIO TECNOLOGIE DI ASSIEMAGGIO TECNOLOGIE DI ASSIEMAGGIO TECNOLOGIE DI ASSIEMAGGIO TECNOLOGIE DI ASSIEMAGGIO

The Microtel group Companies can offer a complete range of technologies to apply in the electronic manufacturing.

ASSEMBLY TECHNOLOGIES

  • SMD, PTH, BGA and BGA on PCB or ceramic
  • IMS
  • Flex
  • Flip-chip
  • Bare chip
  • Wire bonding (Au, Al))

TEST AND CONTROL TECHNOLOGIES

  • Optical inspection according IPC
  • AOI
  • X-ray
  • Ionic contamination

CERAMIC TECHNOLOGIES

  • Thick film hybrids
  • LTCC multilayers
  • Power thick film
  • Pressure Sensors

PACKAGING TECHNOLOGIES

  • Conformal coating
  • Glob top on extended temperature range
  • Die-attach on ceramic substrates
  • Lid ceramic packages
  • Seam welded metallic packages
  • Microlens assembly on optical devices
  • Laser and Ink-jet marking

TEST, CONTROL, SCREENING TECHNOLOGIES

  • Functional trimming on ceramic
  • In- circuit
  • Functional
  • High- Voltage insulation
  • Functional power test on devices and boards
  • Thermal cycles
  • Thermal shocks
  • Burn-in